August 2008
Samtec recently released its newest Rugged PowerStrip, the PowerStrip/25 which is 20% smaller than the industry standard form factor, but is still rated at 25 Amps per contact and allows up to eight power pins on a .200"" (5,08mm) pitch in only one square inch (650 square millimeters) of board space.
Samtec is an industry leader in Board-to-Board, Cable Assemblies and Panel & I/O Interfaces. Additional product and service capabilities include high speed interconnects, the best signal integrity support in the industry, high speed cables and connectors, RF systems, and the ability to design, characterize, and build flex circuits. See page 8.
For more information, visit www.samtec.com
Contact
+27 11 452-8112
or email: africa@samtec.com
Editor's Comment
Microprocessors, Microcontrollers and DSP
Ruggedisation of commercial electronics for defence applications
Alastair Knight, RedLinx
Networking & Databuses
New and emerging telecommunication technologies within the African context (peer reviewed)
Peter Chitamu, Wits University, Johannesburg
Power & Autotronics
TWT Microwave Power Amplifiers - application review
Edited from information supplied by Crane Aerospace & Electronics - Power Solutions
Make your data centre cooler and greener
Information supplied by T TrippLite, Chicago, USA
Semiconductor advances propel high power amplifiers (HPA)
Ashok Bindra, freelance writer for RFMD
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