May 2009
The Cinterion Evolution Platform Cinterion's Evolution Platform is comprised of multiple Cinterion modules offering scalability, compatibility as well as an easy path to future upgrades and added functionality as technology needs expand. Part of the Evolution Platform, the new solderable products include the EES3, EGS5, EGS3 and BGS3 modules which feature efficient and reliable Land Grid Array (LGA) mounting technology along with optimized size and performance. The modules are based on a new advanced processor design and the field proven and reliable Cinterion M2M software stack. About Cinterion Wireless ModulesCinterion Wireless Modules was founded in June 2008 when Siemens spun off its highly successful Wireless Modules business unit. The company specializes in wireless machine-to-machine communication (M2M) based on GSM, GPRS, EDGE, and UMTS/HSPA technology. Cinterion a global leader in wireless module production, offers a broad portfolio of pre-certified products for M2M applications. For more information see page 20. Contact:
Christian Steyn (011) 589-8000
or christian.steyn@cinterion.com
ConnectivityM2M and the Supply Chain Information supplied by Opto Africa Adam-6000: Ethernet I/O modules with peer-to-peer - unlimited distance Information supplied by ProMicro
Editor's Comment
Embedded Systemspackaging and ""un-packaging"" of power modules for renewable energies & electri vehicles Thomas Stockmeier, CTO Semikron Using a network and impedance analyzer to evaluate 13.56 MHz RFID tags and readers/writers Information supplied by Agilent Technologies
Product News
Telecommunications, Manufacturing & AutomationUltra low power meets energy harvesting: A game-changing combination for design engineers Murugavel Raju, MCU Strategic Marketing, Texas Instruments Going grene in telecom shelters Harshul Gupta and P Meenatchi Sundaram, Altec Corporation
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