July 2010
The July 2010 edition features Power & Autotronics and Networking & Databuses, as well as Telecommunications, Manufacturing & Automation.
The first article in Power & Autotronics, by Pierre Turpin at LEM Energy & Automation, presents a new class of Rogowski coil-split core current transducers: the RT series. The second article in this feature, by Martin Hill at Microchip, briefly considers a low resource microcontroller for a three phase brushless DC motor speed controller.
Networking and Databuses contains two articles: The first, from information supplied by Zeus Technology, considers mobile data application delivery control as a solution to keep mobile data flowing - from the mobile network operator (MNO) point of view. The second article, by David Pursley at Kontron, discusses CompactPCI as a suitable solution for military and aerospace applications.
Three articles appear in Telecommunications, Manufacturing & Automation. The first reviews the ICOM digital advanced system (IDAS) in terms of analogue/digital migration, conventional IP networking and trunking. Then, in the last part of a series of articles on electronic packaging systems, Christian Ganninger at Schroff GmbH discusses current applications and ongoing developments in a wide range of industries including military and telecommunications technologies. Finally, Alex Martinez at Microchip Technology considers ‘shrinking geometries' as a major trend in serial interface innovation.
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A new class of Rogowski coil-split core current transducers: the RT series
by Pierre Turpin, Project Manager, LEM Energy & Automation
Low Resource Microcontroller 3 Phase BLDC Motor Speed Controller
by Martin HIll, Microchip
Keeping mobile data flowing Mobile data application delivery control
Information supplied by Zeus Technology
CompactPCI's versatility fuels strong growth in military applications
by David Pursley, Kontron
ICOM digital advanced system (IDAS)
Information supplied by Multisource
Everything a system needs Current applications and ongoing developments
by Christian Ganninger, Schroff GmbH
Shrinking geometries drive innovation in serial interfaces
by Alex Martinez, Microchip Technology Inc