May 2010
The May 2010 edition features Connectivity and Microprocessors, Microcontrollers and DSP, as well as Electronic Manufacturing & Production.
In Connectivity, Dr John Humphries at Electrolube reviews the thermal management of electronics devices with a specific focus on the use of thermally conductive pastes and other methods to displace heat in the manufactured electronics environment. The fourth part in a series of articles on Schroff electronics packaging systems describes the ‘backplane', not only in terms of data transfer connectivity, but also in terms of standards, design and modern manufacturing methods. Quantum Key Distribution (QKD) is described as a ‘cryptographic primitive for the generation of secure random cryptographic keys' that provides an intrinsic physical security for next generation communications systems.
In Microprocessors, Microcontrollers and DSP, Terry Cleveland and Scott Dearborn at Microchip Technology consider the development of affordable mixed-signal power systems for battery charger applications.
Electronic Manufacturing & Production: The first article, from information supplied by Altium, considers modern PCB design and the ever changing design challenges that this discipline perceives. The second article, by Prof M Altaf Mukati at Hamdard University, describes the design of an ECC decoder based on orthogonal parity checksums. A brief review of ‘re-inforced DC/DC converters' manufactured by RECOM concludes this feature.
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Thermal management of electronics devices
by Dr John Humphries, Electrolube
Electronic Packaging: everything a system needs Part IV: The backplane; the heart of an electronics packaging system
by Christian Ganniger and Andreas Lenkisch, Schroff GmbH, Germany
Quantum Key Distribution - a "world first" for Durban
by Abdul R Mirza and Francesco Petruccione, University of KwaZulu-Natal; Gregoire Ribordy, ID Quantique SA; Gaby Lenhart and Paul Reid, European Telecommunications Standards Institute
Developing affordable mixed-signal power systems for battery charger applications
by Terry Cleveland, and Scott Dearborn, Microchip Technology Inc, Chandler, USA
Creating connections between electronics design and manufacturing
Information supplied by Altium
Design and Simulation of ECC Circuits using NI Electronics Workbench Group Software
by Prof M Altaf Mukati, Hamdard University
RE-inforced DC/DC Converters offer up to 10kVDC isolation
Information supplied by Brabek
