November 2010

The features covered in the November 2010 edition are Power & Autotronics and Networking & Databuses, as well as Telecommunications, Manufacturing & Automation.

In Power & Autotronics, Dr Arendt Wintrich at SEMIKRON considers power modules for electric and hybrid vehicles. These require new solutions for module integration and packaging technology in order to achieve the required thermal and electrical properties. Also in this feature, IP camera systems with an industrial camera management solution are reviewed in a short article from information supplied by H3iSquareD.

Networking & Databuses contains two articles: The first article is the concluding second part of optimizing BNC PCB footprint designs by Tsun-kit Chin at National Semiconductors Corporation. The complete first and second parts review a few common problems in BNC footprint designs, and illustrate examples of carefully designed footprints and test results for edge-mount and through-hole connectors used in National Semiconductor's configurable I/O devices. The second article in this feature, from information supplied by VIVOTEK, unveils the latest advances in mega pixel cameras for IP surveillance.

In Telecommunications, Manufacturing & Automation, an article by Malcolm Edwards at AWR Corporation discusses nonlinear modelling. Forming part of the building blocks required by RF and microwave designs, nonlinear devices distort waveforms to the extent that they cannot be accurately represented through superposition or S-parameters. The alternative approaches to nonlinear modeling are therefore discussed and explained. Then, real world challenges in deploying LTE networks are considered in an article from information supplied by 4G Technology. Finally, wireless predictive maintenance techniques are briefly discussed in a short article from information supplied by Beyond Wireless.