Vertiv™ new CoolChip range to be showcased at Datacloud Global Congress
Vertiv, a global leader in critical digital infrastructure, today announced the expansion of its end-to-end thermal chain with the availability of the Vertiv™ CoolChip CDU 2300 and Vertiv™ CoolChip Fluid Network Row Manifolds in Europe, the Middle East and Africa (EMEA). These liquid cooling technologies support the growing demands of AI and high-density, next-generation compute, helping customers deploy high-density infrastructure faster and operate more efficiently.





